Analysis of EMIB packaging technology and industrial development trends
EMIB封装技术与产业发展趋势分析

摘要

人工智能算力需求的爆发式增长推动半导体先进封装技术成为产业发展核心赛道，嵌入式多芯片互连桥接（EMIB）技术作为英特尔研发的2.5D先进封装核心方案，凭借成本、良率、设计灵活性等优势成为异构集成的重要技术路径。本文通过系统阐述EMIB封装的核心原理、工艺特征，对比分析其相对传统封装技术的核心优势，明确其主流应用场景，剖析当前技术发展面临的挑战，并梳理未来技术演进方向，为半导体先进封装产业研究与投资决策提供参考。

Abstract

The explosive growth in demand for artificial intelligence computing power has driven advanced semiconductor packaging technology to become a core track in industrial development. As a core 2.5D advanced packaging solution developed by Intel, Embedded Multi-die Interconnect Bridge (EMIB) technology has emerged as an important technical path for heterogeneous integration, leveraging advantages in cost, yield, and design flexibility. This paper systematically elaborates on the core principles and process characteristics of EMIB packaging, comparatively analyzes its core advantages over traditional packaging technologies, clarifies its mainstream application scenarios, examines the current challenges in technological development, and sorts out the future direction of technological evolution. Meanwhile, combined with the industrial development trends, providing a reference for industrial research and investment decision-making in the semiconductor advanced packaging industry.